UK
Development and production of printed circuit boards
Experienced specialists of our company in a short time will perform the design of printed circuit boards of any complex according to your specifications.
Development of principles, tracing and preparation of a production board to be carried out on the basis of CAD PCAD 2006 (manual and automatic tracing of the printed circuit board) with a possibility of installation of all case`s types of the electronic equipment
Technology of execution of orders for design of electronic units
In our work we use the most optimal technology of order fulfillment, which has been worked out for years, and which is a sequence of 5 stages:
Stage 1 - Ordering
1.1 Pre-order
1.2 Estimation of cost and time of performance of your order
1.3 Confirmation of placing an order for the design of a printed circuit board
Stage 2 - Preparation of the electrical circuit diagram
2.1 Creating a library of components for your order
2.2 Introduction or update of the electrical circuit diagram
2.3 Creating a list of connections (netlist).
Stage 3 - Development of printed circuit boards
3.1 Preliminary distribution of components on the printed circuit board
3.2 Tracing of printed circuit board
3.3 Revision of manual payments to the specified technical and technological parameters (design rules check - DRC)
3.4 Preparation of information for the production of printed circuit boards
Stage 4 - Registration of design documentation
4.1. Registration of design documentation in accordance with the specified requirements
Manufacturing of printed circuit boards of any complexity in accordance with the requirements of the international standard IPC-A-600F at certified factories
Orders are accepted in any format - GERBER RS274X, RS274D, CAM350, PCAD 2001-2006, ORCAD and others.
To estimate the cost of the order, you must send by email (plata@biakom.com) the printed circuit board file and text information that contains the technical requirements for the documentation when ordering printed circuit boards (see below).
Rules for placing an order:
- The customer submits the order form and printed files by e-mail, or at our office.
- A specialist of LLC "Biakom" informs the customer of the cost of different order options (by lead time, quantity, availability of electrical control, etc.)
- After the customer selects the option and confirms the transaction at a cost, an invoice for payment is displayed and is settled by the customer (100% overpayment). Possible option with the conclusion of the contract.
- he customer sends a copy of the payment order by e-mail, fax or in person and thereby confirms the need to start the order using the existing files.
- Attention!!! The lead time is counted from the moment of confirmation of payment and confirmation of launch (approval of order files).
- After making the order, the boards are handed over to the customer along with the documents. Various options for the delivery of printed circuit boards to all regions of Ukraine are used. High-quality packaging eliminates damage to the board during transportation. In the office, the firms presented samples of printed circuit boards that are being manufactured.
- All information is saved and archived.
Re-ordering is possible in any hour.
Technical requirements for documentation when ordering printed circuit boards
- Desirable GERBER files in RS-274-X format and Drill files in Excellon 2 format. Possibly in the form of PCB files made in PCAD 2001, PCAD 2004, PCAD 2006, OrCAD-10.0, ACCEL EDA programs.
- It is also necessary to indicate:
- board size in mm;
- quantity of boards to order;
- production time;
- the presence of a protective mask and markings;
- covering of mounting sites and holes: POS with hot air leveling, chemical tin or ENIG;
- number of layers;
- material for PCB and its thickness;
- board drawing with dimensions for boards that differ from rectangular ones, or which have windows;
- grooves and windows, as well as holes with a diameter of 5 mm and more, show in the Board layer, indicate the presence of metalization in them;
- for multi-layer PCB, indicate the thickness of the board and its structure (if special conditions apply to it);
- requirements for bulk procurement (if any).
The technical processes used in the manufacture of printed circuit boards:
- ENIG (Electroless Nickel Immersion Gold)
- Hot Air Solder Leveling
- Peelable Mask / Carbon Ink Printing
- Immersion Tin / Gold (Flash)
- Selective Plating / Entek Coating
- V-Cut Process / Gold Finger Process
- Blind/Buried Via Hole for M/L
Boundary technology limits for standard boards
| Parameter | ±, mm | ±, inches |
|---|---|---|
| Positioning Accuracy | 0,076 | 0,002 |
| Min distance from components to the edge of the board | 0,003 | |
| Contour offset | 0,150 | 0,006 |
| The minimum gap between the hole and the edge of the board is equal to the thickness of the board material | ||
| Hole tolerances | ||
| Min. metallized hole | 0,20 | 0,010 |
| Max. drilled hole | 6,500 | 0,256 |
| Hole tolerances (metallized) | 0,075 | 0,003 |
| Hole tolerances (non-metallized) | 0,050 | 0,002 |
| Hole taper (t < 0.6 mm) | 0,075 | 0,003 |
| Accuracy of contour manufacturing: | ||
| - when felling | 0,150 | 0,006 |
| - when milling | 0,100 | 0,004 |
| Coating parameters | ||
| Min metallization thickness | 3 um | 120 microinch |
| Min coat thickness Au | 0.05 um | 2 microinch |
| Min coat thickness Ni | 3 um | 120 microinch |
| Max thickness of galvanic copper plating | 28 um | 1 mil or above |
| Max coat thickness Ni | 10 um | 400 microinch |
| Max coat thickness Au | 1.25 um | 50 microinch |
| HAL-process | 2-38 um | |
| Soldering mask | ||
| Min gap | 0,075 | 0,003 |
| Minimum width of the mask line | 0,100 | 0,004 |
| Minimum width between pads | 0,100 | 0,004 |
| The thickness of the mask on the base material | 0.7 to 1.2 mil | |
| - pads | 0.6 to 1.0 mil | |
| - conductors | 0.2 to 0.5 mil | |
| V - Cutting (scoring) | ||
| The board must have at least two parallel lines for the V-score! | ||
| Minimum stored thickness for FR4 | 0.3±0.1 | |
| - for CEM3 for CEM 1 | 0.5±0.1 | |
| Positioning tolerance | ±0.2 | |
| Max board size for V-cut | 387 | 15.25" |
| Min board size for V-cut | 100 | 4.00" |
| Min board thickness for V-cut | 0.6 mm | |
| Acceptable angles 30 and 45 | 30°C & 45°C | |
| Accuracy of contour making with V-cut | ±0.15 | |
| Outer layers | ||
| Min aperture | 0,01 | 0,0004 |
| Min conductor width | 0,10 | 0,0040 |
| Min gap between conductors | 0,10 | 0,0040 |
| Registration tolerance | ±0.075 | ±003 |
| The minimum final thickness of the board is 2-layer | 0,30 | 0,008 |
| - 4-layer | 0,40 | 0,016 |
| - 6-layer | 0,80 | 0,031 |
| Max final thickness of copper 6 oz | 210 micron | 0,0084 |
| Maximum number of layers | 40 | |
| Panel size | ||
| Max panel size | 18" X 24" | |
| Max board size | 17" X 22" | |
